Semiconductor wafer processing is used to manufacture integrated circuits (IC) that are used in all aspects of our lives. Technology is currently being driven by these wafer processing advances and development of the next wave of devices. The silicon wafer surface is generally made up of 200 to 300 identical devices per wafer. The area occupied by an IC is called a die or chip. 
Many steps are involved in the processing of ICs including layers added by deposition by different methods; CVD or chemical vapor deposition, PVD or physical vapor deposition, PEVCD or plasma enhanced physical vapor deposition. RF waves are used to provide energy to target materials. So the level of RF energy, signal purity impedence, frequency and wave shape play an important role in semiconductor manufacturing. 
Another step is etching, where material is etched away from the wafer. RF also plays an important role in this critical process. 
The RF delivery system including RF generators/power supplies and impedence matching networks, which provides the matched impedance interface to the RF generator even when there is a change in plasma impedence are crucial elements in on wafer performance. 
DC and MW are also used in different methodologies to acheive uniformity of wafer performance.